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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 and behavior identified in these
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 and behavior identified in these
$193.00
Description
and behavior identified in these Standards
1-0312 (technical revision)
and facilities managers who specify compatibility requirements for equipment and utility services
9% hydrofluoric acid used in the semiconductor industry
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 and behavior identified in theseThis Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.
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