G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdTpc-Minienvironments · オプションA: 能動搬送（能動OHSなど）で内部ストッカーのロードポートに水平にFOUPを移載する。図1にオプションAを示す。

· オプションA: 能動搬送（能動OHSなど）で内部ストッカーのロードポートに水平にFOUPを移載する。図1にオプションAを示す。

SEMI MF95-1107 (Reapproved 1012)

within semiconductor device manufacturing facilities

SEMI MF1388-0707 (technical revision)

G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdTpc-Minienvironments · オプションA: 能動搬送（能動OHSなど）で内部ストッカーのロードポートに水平にFOUPを移載する。図1にオプションAを示す。This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1986; previously published in 1988. NOTICE: This Document was reapproved with minor editorial changes. The purpose of this test is to determine the thermal