Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-232773 this part of BS 6100

this part of BS 6100 represents a full revision of the standard

delayed or discrete sequential measurement of aerosols in gaseous effluents discharged into the environment

either integral with the water trough or attached to it

including heat treatment

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods Ingestion-build-232773 this part of BS 6100What is BS EN 61191 6 Evaluation of voids in BGA and LGA soldered connections about? BS EN 61191 6 is the sixth part of a multi series standard used for Printed board assemblies that specifies the measuring methods for voids in soldered joints of BGA and LGA. BS EN 61191 6 is useful in evaluating these voids that results in manufacturing good quality printed boards. BS EN 61191 6 specifies the evaluation criteria for voids on the scale of the thermal