C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current computer disk substrates

computer disk substrates

The measurement of equipment system reliability in this Specification concentrates on the relationship between equipment system failures and equipment system usage

The test method covers the procedure for gauging silicon based photovoltaic (PV) cells with respect to LeTID with the aim of comparison/benchmarking of different solar cell concepts

設備在設計上應符合使用者預期的操作方式，以期將錯誤及事故機率降至最低。

C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current computer disk substratesThis Document will provide a guide for the measurements of and reporting of more accurate parameters of hardness of chemical mechanical planarization (CMP) pads, than current industry standards. This Document will provide a guide for the measurement of and reporting of effect of the temperature on the pad hardness. Reference to this Guide can be used in the corresponding certificate of acceptance (CoA) from a CMP supplier to its customers. Reference