Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 and requirements on joints

and requirements on joints

a) electrical test and measurement equipment which by electrical means tests

BS EN 1998-6 establishes requirements

This technical report establishes an American grouping system for materials for welding purposes

Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 and requirements on jointsWhat is this standard about? This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die to die alignment is used in the die stacking.