G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title SEMI M54-0319 (technical revision)

SEMI M54-0319 (technical revision)

This guide is intended for use in abatement selection for both gaseous and particulate contaminant materials potentially emitted from semiconductor manufacturing facilities

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 20

and behavior identified in this Document

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title SEMI M54-0319 (technical revision)This document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i. e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI Standards SEMI G14 Plastic Molded DIP Tooling SEMI G16 Plastic Chip Carrier Tooling SEMI G36 Plastic Molded High Density TAB Quad Tooling SEMI G37 Plastic Molded SO Package Tooling