G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Revision:SEMI G20-96 - Inactive This Guide also describes procedures

This Guide also describes procedures that may be used to generate consensus property values that may form the basis for the generation of multiple sets of CRMs or reference materials (RMs)

SEMI T3 —Specification for Wafer Box Labels

SEMI F40 — Practice for Preparing Liquid Chemical Distribution Components and Neat Polymers for Chemical Testing

FPDプロセスのすべての工程に適用できる。データマトリクスコードのフォーマットとアルゴリズムは，ISO/IEC 16022に規定された二次元記号表示に準拠している。

G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Revision:SEMI G20-96 - Inactive This Guide also describes proceduresThis specification defines lead finishes for plastic packages (e. g., single in line, dual in line, quad in line) using leadframes with SEMI specified leadframe materials. Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G18 Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes SEMI G55 Test Method Measurement of