C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals StdPbc-0309 2 Chemical reagents may include

2  Chemical reagents may include acids

メンテナンスあるいはサービスに必要なあらゆる装置が含まれる。

Therefore process and quality control during manufacturing of wafers requires continuous monitoring of saw marks and waviness with a method that provides reproducible values

SEMI D31-1102 (first published)

C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals StdPbc-0309 2 Chemical reagents may includeThis Test Method provides a standardized test method for measuring and reporting the conductivity of slurries and post chemical mechanical polish (CMP) chemicals. This Test Method defines the number of significant digits to which conductivity will be reported, given the limitations of current metrology and methodology capabilities, and define a standardized temperature for the measurement. This Test Method also supplies a method of calibrating