G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 - Superseded This edition was approved for

This edition was approved for publication by the global Audits and Reviews Subcommittee on May 21

Standardized scan patterns for both local and full-area surface characterization

7-0304 (technical revision)

Email:  mfabiano@semi

G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 - Superseded This edition was approved forNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers